Skip to main content

CompactPCI CPU Boards

CP3005-SA Features: 

  • 3U CompactPCI CPU 4TE/8TE with SSD or XMC mezzanine
  • Quad-core 1.6/2.0/2.5/2.7 GHz 8th/9th generation Intel® Core™ i3/i5/i7 and Xeon E
  • 8/16/32 GByte DDR4 ECC memory
  • up to 1 TByte SATA flash M.2 module (optional)
  • Interfaces Front: 2x GbE (RJ45), 1x VGA, 2x USB 3.0 - additional on
    SSD carrier: 1x GbE (RJ45), 1x USB 3.0, 1x RS-232, 2x DisplayPort
  • 0 to 60°C operating temperature (-40°C to 70°C available)


CP3010-SA Features: 

  • 3U CompactPCI CPU 4TE/8TE with SSD mezzanine
  • Quad-core 1.75/1.91 GHz Intel® Atom™ E38XX
  • 4 GByte DDR3L memory
  • CFast socket
  • Interfaces front: 2x GbE (RJ45), 2x DisplayPort, 2x USB 2.0/3.0
    - additional on SSD carrier: 1x GbE (RJ45), 1x USB 2.0, 1x RS-232,
      1x CAN, 1x audio
  • 0 to 60°C operating temperature (-40°C to 85°C available)


CP6006(X)-SA Features: 

  • 6U CompactPCI CPU 4TE with XMC slot and onboard SSD flash option
  • 8 or 12 core 2.Intel® Xeon® D or Pentium® D1519 
  • 16/32/64 GByte DDR4 ECC memory
  • Interfaces Front: 3x GbE (RJ45), 1x VGA, 2x USB 2.0, 1x RS-232
  • Rear: 2x GbE, 4x SATA, 2x COM, 4x USB, 2x HDMI, GPIO, Fan, ...
    on CP6006(X): 2x 10GBase-KR, PCIe Gen.3 x8, 2x SATA  on J5
  • 0 to 55°C/60°C operating temperature (-40°C to 70°C for D1519)


SP0-S Features: 

  • Rugged conduction cooled 3U CompactPCI CPU 4TE with PMC slot
  • PowerQUICC-III MPC8548E @ 1.0 GHz (optional EEE Grade 3)
  • 1GB of DDR2 SDRAM at 400 MHz with ECC
  • 1/8GB user flash memory
  • Interfaces: 2x GbE, 3x serial RS-422, 5x GPIO
  • Series 500 radiation tolerant version (-40 to 65°C in vacuum)
  • LEO, MEO and GEO Mission Options


CompactPCI I/O Boards

CP6930 Features: 

  • 6U CompactPCI switch 4TE/8TE, PICMG 2.16 compliant
  • Leading edge technology based on BCM56626 chip set
  • 6x 10GbE via SFP+, 2x 1GbE via SFP
  • 24x Gigabit Ethernet ports according PICMG2.16
  • Non-blocking layer 2 & 3 switching & routing, IPv6 compliant
  • Fully managed
  • DHCP server and boot media support
  • Hot swap, IPMI
  • Comprehensive firmware package


CP6105X Features:

  • 6U XMC/PMC carrier for high-speed CompactPCI®
  • System data throughput via PCIe 3.0 x4/x8, PICMG2.20 based
  • Maximum bandwidth by data stream conversion
  • Easy handling: access via front cutouts
  • Operating temperature -40°C to +70°C


CM900 Features: 

  • Rugged 3U CompactPCI carrier board
  • Transparent and PrPMC versions
  • CompactPCI interface supports 32-bit @ 66 MHz
  • PMC interface supports 64-bit @ 66 MHz through PCI-PCI Bridge
  • PMC Connectors are IEEE 1386.1 compliant, J4 is wired as per PICMG 2.3 Rev.1.0
  • Front panel area for PMC I/O
  • All 64 PMC I/O pins routed to J2 connector
  • Conduction and air cooled versions
  • Three ruggedization levels