UltraScale+ SOFI AMC Carrier Board with conduction cooled options
Vadatech announces AMC549
Henderson, NV – July 31, 2024 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC549. The AMC549 is SOFI carrier that allows any of the VadaTech SOFI module to interface with the high speed UltraScale+ XCVU13P FPGA. The module has a second tongue which allows addition x16 SERDES routed to the backplane.
The unit has an onboard, re-configurable UltraScale+ XCVU13P FPGA that directly interfaces with high speed ADC/DAC and a single bank of DDR4 memory channels (64-bit wide for a total of 8 GB). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
The AMC549 8 HP panel size will occupy two mid-size slots within a chassis and is available for conduction cooled options.
SOFI modules are available with high-speed ADC, DAC and RF transceiver combinations.
Please consult with EMCOMO Sales to discuss ruggedization and other specific ordering options.
For more information contact vadatech@emcomo.de.