VPX777

Description:

VPX777 is a 3U Form Factor Processor VPX (PrVPX) module powered by the 20-core (40-thread) Intel® Xeon® D-2896TER (Ice Lake-D) processor for demanding embedded applications. It features four channels of DDR4 memory, 64 GB of ECC RAM, and a 128 GB SSD. The BIOS supports booting via onboard SSD, PXE, or USB.

The P1 connector provides:

• Single 100/40GbE (or quad 10/1GbE)
• PCIe x8 Gen 4 (bifurcated to dual x4)
• 1000BASE-T
• Dual 10/1GbE

The P2 connector routes a PCIe x16 Gen 4 interface, which can be bifurcated to quad x4 or dual x8. Both P1 and P2 support USB 2.0 and RS-232.

For security, the module combines a Trusted Platform Module (TPM) with Intel® Boot Guard and Platform Firmware Resilience (PFR) on an onboard FPGA, which customers can reprogram for tailored security. The board complies with VITA 65 slot profile SLT3-PAY-1F2F1TP2U1QF and ships with Linux OS standard.

Due to a power dissipation of ~150W, appropriate system-level cooling is required; consult EMCOMO sales for thermal management guidance

Linux OS is standard on the VPX777, consult EMCOMO for other options.

Key Features:

• Intel® Ice Lake-D Xeon® D-2396TER
  • 20 Core (40 Threads)
• 100/40GbE or octal 10/1GbE on P1
• PCIe x8 Gen 4 on P1
• 1000BASE-T on P1
• Dual 10GbE/GbE on P1
• PCIe x16 Gen 4 on P2
• USB and RS-232 on P1/P2
• 64 GB of DDR4 memory with ECC
• 128 GB SSD
• Serial Over Lan (SOL)
• Platform Firmware Resilience (PFR) via on board FPGA for security
• Trusted Platform Management (TPM)

VPX777 Datasheet