Intel Ice Lake-D Processor Xeon D-2896TER with 1/10/40/100GbE and PCIe – 3U VPX
Vadatech announces VPX777
Henderson, NV – May 27, 2026 – VadaTech, a leading manufacturer of integrated systems and embedded boards and chassis, enabling software and application ready platforms, announces VPX777.
The VPX777 is a 3U Form Factor Processor VPX (PrVPX) module powered by the 20-core (40-thread) Intel® Xeon® D-2896TER (Ice Lake-D) processor for demanding embedded applications. It features four channels of DDR4 memory, 64 GB of ECC RAM, and a 128 GB SSD. The BIOS supports booting via onboard SSD, PXE, or USB. The P1 connector provides: Single 100/40GbE (or quad 10/1GbE) PCIe x8 Gen 4 (bifurcated to dual x4) 1000BASE-T Dual 10/1GbE The P2 connector routes a PCIe x16 Gen 4 interface, which can be bifurcated to quad x4 or dual x8. Both P1 and P2 support USB 2.0 and RS-232. For security, the module combines a Trusted Platform Module (TPM) with Intel® Boot Guard and Platform Firmware Resilience (PFR) on an onboard FPGA, which customers can reprogram for tailored security. The board complies with VITA 65 slot profile SLT3-PAY-1F2F1TP2U1QF and ships with Linux OS standard.
- Intel® Ice Lake-D Xeon® D-2396TER
- 20 Core (40 Threads)
- 100/40GbE or octal 10/1GbE on P1
- PCIe x8 Gen 4 on P1
- 1000BASE-T on P1
- Dual 10GbE/GbE on P1
- PCIe x16 Gen 4 on P2
- USB and RS-232 on P1/P2
- 64 GB of DDR4 memory with ECC
- 128 GB SSD
- Serial Over Lan (SOL)
- Platform Firmware Resilience (PFR) via on board FPGA for security
- Trusted Platform Management (TPM)
Please contact EMCOMO's sales team to discuss ordering options, system integration and technical support.
For more information see VPX777 page or contact vadatech@emcomo.de.