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Meet us at the following events:

Embedded World 2018

Nürnberg Messe

Tuesday, February 27, 2018 to Thursday, March 1, 2018

At our booth 678 in hall 4 we show interesting products and news:

Latest generation Intel Core i7 Box-PCs including TSN (IEEE 802 Time Sensitive Ethernet Network) interfaces for Embedded Cloud applications

MicroTCA systems/boards with Xilinx Ultrascale+ FPGA, High-Speed ADCs, Gigabit Ethernet Switches, Intel and NXP CPUs

FPGA Automotive ADAS Box with Xilinx Zynq FPGA and 5 camera interfaces

Rugged GPGPU system based on NVDIA Jetson TX2 with flight simulation demo